Cart (Loading....) | Create Account
Close category search window
 

Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Han, B. ; Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA ; Changsoo Jang ; Bar-Cohen, A. ; Bongmin Song

Coupled thermal and mechanical design issues in a high power light emitting diode (LED) package platform are investigated using numerical models. A thermal resistance network model and a 3-D finite element model are built for thermal and stress analyses. They are validated with the experimental data and subsequently utilized to study the effect of key parameters on the junction temperature and the thermal strains. An extensive parametric analysis is conducted to assess the effect of design and material parameters on the junction temperature and thermal strains of the high power LED under study. Based on the results, the desired parameters of adhesives for high power LED applications are identified and an example of an LED thermo-mechanical design protocol is presented.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:33 ,  Issue: 4 )

Date of Publication:

Dec. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.