By Topic

UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Christiaens, W. ; Dept. of Electron. & Inf. Syst., Ghent Univ., Ghent, Belgium ; Bosman, E. ; Vanfleteren, J.

Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:33 ,  Issue: 4 )