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Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects

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6 Author(s)
Hoang-Vu Nguyen ; Inst. of Micro & Nano Syst. Technol., HiVe-Vestfold Univ. Coll., Borre, Norway ; Kristiansen, H. ; Gakkestad, J. ; Johannessen, R.
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Isotropic conductive adhesive (ICA) filled with metal coated polymer spheres has been studied as a novel approach to increase the flexibility, and hence the reliability of the adhesive compared to traditional metal filled ICAs. In this paper, we have investigated the rheological properties of the novel ICA to evaluate its applicability in practical use. The current work also involves the investigation of the mechanical properties including shear strength of the novel ICA. Spherical polymer particles (SPP) of sizes Ø6 μm and Ø30 μm were investigated in the present study. The results show minor differences in the rheological properties and the adhesion strength for adhesives filled with particles in different sizes. Filling SPP into the adhesive matrix increases the viscosity of the system monotonically and continuously, in excellent accordance with model systems previously reported in the literature. Furthermore, the novel ICA exhibits high mechanical shear strength, being comparable to the traditional solder joint technology and twice higher than the traditional metal filled ICA.

Published in:

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Date of Conference:

13-16 Sept. 2010