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Modular modeling approach to consider RF and thermal behavior of complex systems built up using interconnect structures in 3D integration

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5 Author(s)
Reitz, S. ; Div. Design Autom. Dresden, Fraunhofer Inst. for Integrated Circuits, Dresden, Germany ; Stolle, J. ; Martin, R. ; Wilde, A.
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Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered very early in the design process of 3D systems. Therefore, information from different physical domains, design rules, and guidelines have to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.

Published in:

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Date of Conference:

13-16 Sept. 2010

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