Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Modular modeling approach to consider RF and thermal behavior of complex systems built up using interconnect structures in 3D integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Reitz, S. ; Div. Design Autom. Dresden, Fraunhofer Inst. for Integrated Circuits, Dresden, Germany ; Stolle, J. ; Martin, R. ; Wilde, A.
more authors

Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered very early in the design process of 3D systems. Therefore, information from different physical domains, design rules, and guidelines have to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.

Published in:

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Date of Conference:

13-16 Sept. 2010