By Topic

Optimization of lead-free wave soldering process using taguchi orthogonal arrays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Pavel Mach ; Czech Technical University in Prague, Czech Republic ; Přemysl Zeman ; Eva Kotrčová ; Seba Barto

Process of lead-free soldering is deeply monitored starting from July 2006, when RoHS directive was activated. The goal of the work was to analyze influence of 4 control parameters of a process of lead-free soldering on bridging and filling of through holes on a test board. Following control parameters (factors) were taken into account: the solder temperature, the time of a contact between the soldered area and solder, the preheating temperature and flux wettability. Every factor was used in 3 levels. Taguchi orthogonal array of the type L9 was used for process analysis. The analysis showed that bridging is influenced with the preheating temperature and with the time of a contact between solder and a pad dominantly, influence of the solder temperature is minimal. The filling of the through hole depends above all on the preheating temperature; influence of other control parameters is low. It has been also confirmed effectiveness of the use of Taguchi orthogonal array in comparison with full factorial experiments.

Published in:

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Date of Conference:

13-16 Sept. 2010