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With respect to a planar approach, 3D stacking of functional layers allows to increase the level of integration and miniaturization of communications systems. For this paper, a full 3D stacking demonstration vehicle has been realized and characterized. The feasibility of a 3D micro-wave module package has been proven by the successful realization of a 30 GHz 3D module including substrate vias, low loss interconnects, substrate shielding and MMIC integration. The impact of wire bond and CAP integration on 3D packaging performance were also investigated.