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We have developed a new Fan-Out Wafer-Level Packaging (FO-WLP) technology with flexible design capabilities for multilayer fan-out redistribution layers (RDLs) connected to the fine-pitch I/O pads of chips. The prototype of a 2.0 mm × 2.0 mm FO-WLP with 25-pin land grid array (LGA) including a 1.6 mm × 1.6 mm microcontroller chip was fabricated and evaluated. Board-level reliability was also confirmed using 5.0 mm × 5.0 mm FO-WLP. This technology is suited for applications in extremely small microcomputer chip/system packaging for ubiquitous computing.
Date of Conference: 13-16 Sept. 2010