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A 3 channel ECG system with wireless data transmission is presented. It is built as a System in Package (SiP) consisting of 6 dies and 39 SMD components mounted on a FR4 substrate at a size of 2.45 × 2.45 mm2. Design considerations and ASIC partitioning is addressed in this work. In addition, measurement results are presented proving that a SiP can compete with a System on Chip.
Date of Conference: 13-16 Sept. 2010