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A novel fabrication method for stacking metal substrates using AMS (Anodized Metal Substrate) is suggested. This stacking technology can meet needs about superior heat dissipation capabilities for multi layer substrate in some application fields like automobile electronics applications. Moreover conventional processes which have been used for normal PCB (Printed Circuit Board) process and any special processes are not adopted for it. Therefore stacked structure over 4 layers using AMS can be realized by low cost. The realized stacked substrate is applied to automobile ISM (Image Sensor Module). The maximum temperature difference between surface of the hottest point of AMS and organic PCB reach about 10 °C. Through decrease of temperature of the hottest part, various components on the substrate can be protected from excessive heat. Therefore reliability and performance of module can be improved drastically.