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The electrical performances of nano-interconnects are affected by temperature and size, which may seriously limit the current density and the reliability. This paper introduces such effects in the modelling of the electrical resistance of nano-interconnects, either made by copper and carbon-nanotubes. A simple and accurate semi-analytical model is proposed to describe the impact of size and temperature changes on the resistance of carbon nanotube interconnects. Case-studies are carried out with reference to 22nm technology node applications.