I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC

In today's integrated circuits, power consumption has become the most important factor, and must be seriously investigated among the various performance metrics. In this study, power estimations for various through-silicon via (TSV)-based three-dimensional integrated circuit (3D IC) designs were conducted in efforts to realize low-power-consumption 3D IC. In addition, the dominant power-consuming factor was found among the TSV-based interconnect components by a power comparison analysis based on the proposed model.