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Transient Fault and Soft Error On-die Monitoring Scheme

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3 Author(s)
Daniele Rossi ; Dept. of Electron. & Comput. Sci. (DEIS), Univ. of Bologna, Bologna, Italy ; Martin Omana ; Cecilia Metra

In this paper we propose an on-die monitoring scheme to detect and count transient faults (TFs) resulting, as well as not resulting in output SEs, affecting the inputs of data-path latches/flip-flops. This approach allows an early monitoring of the latches/flip-flops vulnerability to TFs, thus discovering intrinsic weaknesses of design or process. The proposed monitoring scheme features a very low impact on area overhead and power consumption, thus being suitable to be deployed within any IC.

Published in:

2010 IEEE 25th International Symposium on Defect and Fault Tolerance in VLSI Systems

Date of Conference:

6-8 Oct. 2010