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Impact of exposure doses on demolding process in UV nanoimprint lithography

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5 Author(s)
Tanabe, Toshiaki ; Department of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-cho, Sakai, Osaka 599-8531, Japan and Japan Science and Technology Agency Core Research of Evolutional Science and Technology (CREST), 4-1-8, Honcho, Kawaguchi-shi, Saitama 332-0012, Japan ; Fujii, Noriyoshi ; Matsue, Masato ; Kawata, Hiroaki
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The impact of exposure doses on the demolding process in UV nanoimprint lithography (UV NIL) was studied. The PAK-01 resist was examined to investigate the dependence of the conversion ratio and elastic modulus on the adhesion force between the mold and the resist for various UV dosages. Also, adhesion forces between the resist and SiO2/Si mold were measured in various dosages. The results show that the adhesion force is unstable until the elastic modulus of the resist is enlarged enough even if the chemical conversion is completed by UV exposure. On the other hand, the demolding in the actual UV NIL experiment is not successful at lower dosages. Based on these evaluations, a suitable exposure dosage is suggested for successful demolding to realize a high throughput UV NIL process without demolding defects.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:28 ,  Issue: 6 )

Date of Publication:

Nov 2010

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