By Topic

Electromechanical property characterisation of three-dimensional helical nanobelts by in situ gold nanoink soldering

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $33
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Gilgueng Hwang ; Institute of Industrial Science, The University of Tokyo, 4-6-1, Komaba, Meguro-ku, 153-8505 Tokyo, Japan ; H. Hashimoto

The authors report gold nanoink-based in situ scanning electron microscope (SEM) compatible nanosoldering technique to interconnect three-dimensional thin-film nanostructures and electrodes for their assembly of nanoelectromechanical systems. Helical nanobelts are placed onto as-fabricated gold electrodes using nanomanipulation inside a SEM then deposited with gold nanoink to improve the electrical conductivity and mechanical stability. Electromechanical characterisations of helical nanobelts and nanowires reveal the reduced contact resistance and mechanically strong assembly. It is promising to the application of prototype device assembly and manipulations of various nanostructures.

Published in:

IET Micro & Nano Letters  (Volume:5 ,  Issue: 5 )