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The authors report gold nanoink-based in situ scanning electron microscope (SEM) compatible nanosoldering technique to interconnect three-dimensional thin-film nanostructures and electrodes for their assembly of nanoelectromechanical systems. Helical nanobelts are placed onto as-fabricated gold electrodes using nanomanipulation inside a SEM then deposited with gold nanoink to improve the electrical conductivity and mechanical stability. Electromechanical characterisations of helical nanobelts and nanowires reveal the reduced contact resistance and mechanically strong assembly. It is promising to the application of prototype device assembly and manipulations of various nanostructures.