Cart (Loading....) | Create Account
Close category search window
 

Evolution of Electromagnetic Properties and Microstructure With Sintering Temperature for {\hbox {MgB}}_{2}/{\hbox {Fe}} Wires Made by Combined In-Situ/Ex-Situ Process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Li, W.X. ; Inst. for Supercond. & Electron. Mater., Univ. of Wollongong, Wollongong, NSW, Australia ; Zeng, R. ; Zhang, Y. ; Xu, X.
more authors

The influences of microstructure, connectivity, and disorder on the critical current density, Jc, are discussed to clarify the different mechanisms of Jc(H) in different magnetic field ranges for in-situ and combined in-situ/ex-situ MgB2/Fe wires. Sintering temperature plays a very important role in the electromagnetic properties at different temperatures and under various magnetic fields. Connectivity, upper critical field, Hc2 , and irreversibility field, Hirr, are studied to demonstrate the mechanism of Jc dependence on magnetic field. The combined in-situ/ex-situ process is proved to be a promising technique for fabrication of practical MgB2 wires.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:21 ,  Issue: 3 )

Date of Publication:

June 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.