Cart (Loading....) | Create Account
Close category search window
 

Titanium nitride-molybdenum metallizing method for aluminum nitride

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Asai, H. ; Toshiba Corp., Yokohama, Japan ; Ueno, F. ; Iwase, N. ; Sato, H.
more authors

A paste containing molybdenum (Mo) and titanium nitride (TiN) powders was printed on aluminum nitride (AlN) substrates and postfired. The adhesion strength of metallized substrates with Ni/Au plate was about 25 kgf/2.5 mm and was unchanged after the thermal cycle test. TiN-Mo does not adhere to the grain boundary phase in AlN substrate, or to the surface oxide layer, but to the AlN grain itself. This method, therefore, seems to be applicable to any kind of AlN substrate, which may have different grain boundary oxide phases and thermal conductivities. This TiN-Mo metallized AlN substrate was tried as a replacement for a beryllium oxide (BeO) heat sink, which has been used for RF power transistors. There was no trouble in assembling the AlN heat sinks into transistors. Thermal resistance and electrical properties for transistors with AlN heat sinks were almost equal to those for transistors with BeO heat sinks. The TiN-Mo metallized AlN substrates were found to be suitable for replacing BeO substrates as the heat sinks for semiconductor devices

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )

Date of Publication:

Jun 1990

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.