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Parameter-specific ring oscillator for process monitoring at the 45 nm node

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6 Author(s)
Wang, L.T.-N. ; Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, CA, USA ; Xu, N. ; Toh, S. ; Neureuther, A.R.
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Parameter-specific ring oscillator (RO) experimental results are reported, demonstrating the ability to electronically distinguish and quantify sources of variations from gate lithography focus, gate-to-active overlay, nitride contact etch stop layer (CESL) strain, and Shallow Trench Isolation (STI) stress. A 2% RO frequency change due to gate focus variations, a three-four nm overlay error, a 20% increase in RO frequency per 1 um increase in length of diffusion (LOD), and a 3% speed-up per 0.3 um change in STI width are measured. Typical standard-deviation/mean (σ/μ) among 36 ROs within-chip is 0.2-0.3%.

Published in:

Custom Integrated Circuits Conference (CICC), 2010 IEEE

Date of Conference:

19-22 Sept. 2010