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An ultra heat-shock resistant die-attach structure for a silicon carbide power device was developed. A silicon carbide die with a gold/titanium nitride coating was soldered with pure zinc onto a DBC with a silicon nitride insulator plate. This die-attach structure could resist severe thermal shock in air temperatures between -50°C and 300°C. No substantial change in microstructure was observed at the soldering interface, while conventional high-lead solder forms severe cracking. This die-attach structure can be also applied to other types of high-temperature device applications.