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Benzocyclobutene interlayer dielectrics for thin film multichip modules

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6 Author(s)
R. W. Johnson ; Dept. of Electr. Eng., Auburn Univ., IL, USA ; T. L. Phillips ; W. K. Weidner ; S. F. Hahn
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An organic dielectric derived from benzocyclobutene has been investigated as an interlayer dielectric for thin-film multichip modules. The material is processed using standard semiconductor techniques. Key attributes of the polymer are a low dielectric constant (2.7), low moisture absorption (0.2-0.3%), low processing temperature (250°C), good chemical resistance, and high thermal stability (approximately 350°C). The material provides an alternative to polyimide as a thin-film insulator

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 2 )