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Benzocyclobutene interlayer dielectrics for thin film multichip modules

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6 Author(s)
Johnson, R.W. ; Dept. of Electr. Eng., Auburn Univ., IL, USA ; Phillips, T.L. ; Weidner, W.K. ; Hahn, S.F.
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An organic dielectric derived from benzocyclobutene has been investigated as an interlayer dielectric for thin-film multichip modules. The material is processed using standard semiconductor techniques. Key attributes of the polymer are a low dielectric constant (2.7), low moisture absorption (0.2-0.3%), low processing temperature (250°C), good chemical resistance, and high thermal stability (approximately 350°C). The material provides an alternative to polyimide as a thin-film insulator

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )

Date of Publication:

Jun 1990

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