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Simulation and design of lossy transmission lines in a thin-film multichip package

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3 Author(s)
Nayak, D. ; Microelectron. Center of North Carolina, Research Triangle Park, NC, USA ; Hwang, L.-T. ; Turlik, I.

A thin-film multichip package design was evaluated for its applications in packaging high-performance VLSI/ULSI chips. Typical thin-film interconnections (copper lines 8 μm wide and 4 μm thick) were analyzed, and a large CMOS driver was used in the simulation. It was found that a pitch of 32 μm for the microstrip configuration and 20 μm for the stripline configuration is required to obtain a low-crosstalk environment for an input frequency up to 1 GHz. It is shown that long lines (length between 8 cm and 18 cm) do not need any termination, but short lines (shorter than 8 cm, but longer than the length at which a line is considered to be a lumped circuit) must be terminated with customized termination resistors to obtain optimal package performance. The loading effects n the termination behavior of short and long thin-film microstrips are also discussed. It is shown that high power generation in thin-film lines at a high frequency (1 GHz) would require an advanced cooling technique for the thin-film multichip package

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )