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Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces

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4 Author(s)
Bi-Shio Chiou ; Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Liu, K.C. ; Jenq-Gong Duh ; Palanisamy, P.S.

Intermetallic formation between a thick-film mixed bounded conductor and Sn/Pb solder is investigated. The microstructural evolution of the interfacial morphology, elemental and phase distribution is probed with the aid of electron microscopy and X-ray diffraction. There exists mechanical interlocking between conductor and substrate. Penetration of the element Bi into the substrate is observed. A decrease in adhesion strength occurs when the sample is aged at 130°C for a long period of time. Microstructural analysis reveals the segregation of Pb-rich and Sn-rich phases in aged samples and formation of intermetallic compounds Pd3Sn2, Pd 2Sn, Pd3Sn, PdSn, Ag5Sn, and Ag3 Sn. It is argued that conductor swelling caused by tin diffusion into the conductor film and volume change resulting from the intermetallic formation are major factors in the degradation of the peel strength

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )

Date of Publication:

Jun 1990

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