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A closed form analytical model for the electrical properties of microstrip interconnects

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1 Author(s)
Bogatin, E. ; Xinix Inc., Santa Clara, CA, USA

A simple model is presented based on closed-form analytical approximations for the resistance, capacitance, inductance, and conductance of a generic microstrip interconnect. Working in the frequency domain, all the low-frequency lumped circuit and high-frequency transmission line properties can be calculated. As examples, this model is applied to high-frequency reflectivity measurements on Teflon and FR4 printed circuit board microstrips. Agreement to better than 5% up to 1 GHz is obtained by using a dielectric constant of 2.20 and dissipation factor of 0.004 for the Teflon boards and a dielectric constant of 4.9 at 1 MHz with a constant dissipation factor of 0.022 for the FR4 microstrips. This model enables packaging engineers to evaluate the possibilities of an interconnect technology very simply on their personal computers (PCs)

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 2 )