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Precision machining of silicon wafers using multi-cutters

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1 Author(s)
Zhanhui Yan ; School of Mechatronics, Changchun Institute of Technology, China

The majority of integrated circuits are constructed on silicon wafers nowadays. Precision machining process has great potential to improve wafer quality at a low cost, this paper addressed a new method of machining silicon wafers and its general mathematical model to predict the locus of the machining lines and the distance between two adjacent machining lines using multi-cutters simultaneously. Mathematical expression of machining model was derived, experimental results on experimental device prove feasibility of this new machining method with multi-cutters.

Published in:

2010 International Conference on Computer, Mechatronics, Control and Electronic Engineering  (Volume:2 )

Date of Conference:

24-26 Aug. 2010