By Topic

A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ozkilic, M.C. ; OHM Elektron., İstanbul, Turkey ; Honsberg, M. ; Radke, T.

Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can be evaluated easily by the described evaluation platform.

Published in:

Power Electronics and Motion Control Conference (EPE/PEMC), 2010 14th International

Date of Conference:

6-8 Sept. 2010