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Wire-bond lift-off is one of the main failure mechanisms encountered in IGBT power modules, due to thermal stress subjected in operation. To evaluate reliability degradation of IGBT, phenomena of early fault phase are essential. In this paper, electrical transient response of gate driver circuit after some wire-bonds lift-off is investigated, and the deviation observed will advance the fault prognostic of IGBT as precursor.
Date of Conference: 6-8 Sept. 2010