By Topic

Full-Spectrum Spatial–Temporal Dynamic Thermal Analysis for Nanometer-Scale Integrated Circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Zyad Hassan ; Department of Electrical, Computer, and Energy Engineering, University of Colorado, Boulder, CO, USA ; Nicholas Allec ; Fan Yang ; Li Shang
more authors

This paper presents NanoHeat, a multi-resolution full-chip dynamic integrated circuit (IC) thermal analysis solution, that is accurate down to the scale of individual gates and transistors. NanoHeat unifies nanoscale and macroscale dynamic thermal physics models, for accurate characterization of heat transport from the gate and transistor level up to the chip-package level. A non-homogeneous Arnoldi-based analysis method is proposed for accurate and fast dynamic thermal analysis through a unified adaptive spatial-temporal refinement process. NanoHeat is capable of covering the complete spatial and temporal modeling spectrum of IC thermal analysis. The accuracy and efficiency of NanoHeat are evaluated, and NanoHeat has been applied to a large industry design. The importance of considering fine-grain temperature information is illustrated by using NanoHeat to estimate temperature-dependent negative-bias-temperature-instability (NBTI) effects. NanoHeat has been implemented and publicly released for free academic and personal use.

Published in:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems  (Volume:19 ,  Issue: 12 )