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Low temperature sintering of Ag nanoparticles for flexible electronics packaging

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7 Author(s)
Hu, A. ; Department of Mechanical and Mechatronics Engineering, Centre for Advanced Material Joining, University of Waterloo, 200 University Avenue West, Waterloo, Ontario N2L 3G1, Canada ; Guo, J.Y. ; Alarifi, H. ; Patane, G.
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We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle (NP) solution via centrifuging. The bonding is formed by solid state sintering of Ag NPs through neck growth and direct metallic bonding between clean Ag–Cu interfaces. Both experiment and Monte Carlo simulation confirm that the melting point of joint clusters increases during sintering. This creates improved bonds for use at an elevated operating temperature using Ag NPs.

Published in:

Applied Physics Letters  (Volume:97 ,  Issue: 15 )

Date of Publication:

Oct 2010

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