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This paper proposes a dynamic electrothermal model that can be simulated with the power electronic circuit simulator. It includes a temperature-dependent loss calculation of power semiconductor devices. The proposed model is used to estimate the transient junction temperature of the semiconductor devices. In so doing, the resulting junction temperature is used to facilitate the power sharing between parallel-connected converters. The use of power-cycling method based on junction temperature helps in increasing the over all system efficiency and reliability of the system. This part of the paper focuses on the method of thermal modeling and discusses how the model can be used for different converters, modulation techniques, and devices.