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The influence of pad geometry on ceramic ball grid array solder joint reliability

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2 Author(s)
Yee, S. ; Solectron Corp., Milpitas, CA, USA ; Ladhar, H.

The reliability of the solder joints on dog bone pads with hot air solder levelling (HASL) finish was found to be statistically different and less reliable than other combinations. The reliability of all other combinations was not significantly different. Both pad geometries and surface finishes evaluated in this study produced excellent, reliable solder joints. The selection of the pad geometry and surface finish will not have significant impact on CBGA solder joint reliability. Since the study was based on mechanical deflection system (MDS) test technology, the limitations for MDS will apply. Additional accelerated thermal cycling (ATC) tests to verify the conclusion will definitely be of value

Published in:

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Date of Conference:

14-16 Oct 1996