Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 5:00 PM ET (12:00 - 21:00 UTC). We apologize for the inconvenience.
By Topic

The influence of pad geometry on ceramic ball grid array solder joint reliability

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yee, S. ; Solectron Corp., Milpitas, CA, USA ; Ladhar, H.

The reliability of the solder joints on dog bone pads with hot air solder levelling (HASL) finish was found to be statistically different and less reliable than other combinations. The reliability of all other combinations was not significantly different. Both pad geometries and surface finishes evaluated in this study produced excellent, reliable solder joints. The selection of the pad geometry and surface finish will not have significant impact on CBGA solder joint reliability. Since the study was based on mechanical deflection system (MDS) test technology, the limitations for MDS will apply. Additional accelerated thermal cycling (ATC) tests to verify the conclusion will definitely be of value

Published in:

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Date of Conference:

14-16 Oct 1996