By Topic

Application for ball grid array package by using high heat resistant substrate (BN300)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Hagimura, A. ; Mitsui Toatsu Chem. Inc., Yokohama, Japan ; Shima, K. ; Asahina, K. ; Sakuraba, H.
more authors

High heat resistance substrate material, BN300, which MTC has developed utilizing MTC's polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed

Published in:

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Date of Conference:

14-16 Oct 1996