Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Automatic visual to tactile translation. II. Evaluation of the TACTile image creation system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Way, T.P. ; Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA ; Barner, K.E.

This is the second part of a two-part paper that develops a method for the automatic conversion of images from visual to tactile form. In Part I (see ibid. vol.5, no.1, p.81-94 (1997)), a variety of topics mere reviewed including issues in human factors, access technology for tactile graphics production, and image processing. In this part, the material presented in the first part is used to motivate, develop, and support the methods used in the development of a prototype visual-to-tactile translator called the TACTile Image Creation System (TACTICS). The specific choices made in the design of the system are discussed and justified, including selection of software platform, tactile output format, tactile image creation procedure, aggregate image processing sequences used, and principles from the discipline of psychophysics. The results of four experiments on tactile image discrimination, identification, and comprehension are reported and discussed, and future directions in this area are proposed

Published in:

Rehabilitation Engineering, IEEE Transactions on  (Volume:5 ,  Issue: 1 )