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Area bonding conductive epoxy adhesives for low-cost grid array chip carriers

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2 Author(s)
Bolger, J. ; Bolger Corp., Needham, MA, USA ; Czarnowski, J.M.

This paper describes a new type of Z-axis epoxy film adhesive, called area bonding conductive (ABC) epoxies, to replace solder and solder balls for surface mounting grid array chip carriers. The ABC adhesives are made by a low-cost screen printing process, starting from customer-supplied artwork, so that the conductive epoxy regions are located only at the desired bond pad locations. Reliability data, presented for plastic and LTCC packages attached to FR-4 boards with these adhesives, show better resistance to thermal cycling and thermal shock than soldered packages. This paper also describes a new low-cost copper-lidded pad array chip carrier (Cu-PAC), which uses an ABC epoxy for die and for substrate attach. The Cu-PACs have the potential for major cost savings, size reduction, and improved heat removal compared to present molded plastic grid array (PGA) packages

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Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on  (Volume:19 ,  Issue: 3 )