Close category search window
 

Fabrication and reliability test of rigid-flexible optical printed circuit boards for mobile devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sung Hwan Hwang ; Korea Photonics Technol. Inst., Gwangju, South Korea ; Woo Jin Lee ; Jung Woon Lim ; Byung Sup Rho

A rigid-flexible optical printed circuit board (PCB) is described in fabrication and reliability. The satisfactory reliability results of below 0.5 dB variation are presented for reflow, foldering, and thermal shock test.

Published in:
OptoeElectronics and Communications Conference (OECC), 2010 15th

Date of Conference: 5-9 July 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.