By Topic

Thermal-Aware Compilation for Register Window-Based Embedded Processors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sabry, M.M. ; Embedded Syst. Lab. (ESL), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland ; Ayala, J.L. ; Atienza, D.

The development of compiler-based mechanisms to optimize the thermal profile of large register files to improve the processor reliability has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the thermal profile of the devices is also related to the leakage power consumption and the cooling cost. Register window-based architectures provide a relatively large register files. However, such large register files are not designed or utilized for thermal balancing or reliability enhancement. In this letter, we propose a compilation flow that utilizes the register windows to optimize the thermal profile and to reduce the hotspots. As a result, the thermal profile and reliability of the device is clearly improved. Simulation results show that the proposed flow achieves up to 91% reduction of hotspots and 11% reduction of the peak temperature in embedded processors.

Published in:

Embedded Systems Letters, IEEE  (Volume:2 ,  Issue: 4 )