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Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

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7 Author(s)
TieJun Zhang ; Dept. of Mech., Aerosp. & Nucl. Eng., Rensselaer Polytech. Inst., Troy, NY, USA ; Wen, J.T. ; Peles, Y. ; Tao Tong
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Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

Published in:

Automation Science and Engineering (CASE), 2010 IEEE Conference on

Date of Conference:

21-24 Aug. 2010