Cart (Loading....) | Create Account
Close category search window
 

Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Baomin Wang ; Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China ; Liangliang Li

The noise suppression effects of nanogranular magnetic film CoFeHfO on the transmission lines on a printed circuit board were investigated by finite element modeling. Two kinds of transmission lines with CoFeHfO thin film, microstrip line (MSL) and coplanar waveguide (CPW), were simulated in the frequency range of 0.1-10 GHz by HFSS™ and their power absorption and S parameters were analyzed. The numerical simulation showed that soft magnetic film CoFeHfO with a high magnetic permeability and electrical resistivity could greatly reduce the noise of the transmission lines. With the magnetic film, the S21 quickly dropped ~10 dB and the power absorption reached ~0.6 at 10 GHz. In order to further enhance the noise suppression, the electrical resistivity of the magnetic thin film was varied from 16 to ∞ μΩ·cm in the simulation, and the strongest noise suppression was obtained at an electrical resistivity of ~1.6×105 μΩ·cm, which indicated that an optimal electrical resistivity was needed for magnetic material. In addition, the noise suppression mechanism was studied by the analysis of the electric field distribution near the transmission line.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.