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Piezoresistive pressure sensors based on system in packaging technology of MEMS

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4 Author(s)
Xiong Shi ; Electr. & Inf. Dept., Wuhan Polytech. Univ., Wuhan, China ; Jian Xu ; Zhiyin Gan ; Sheng Liu

The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a metal shell by SIP technology and special packaging techniques to form a full pressure sensor. Tests have proved that this kind of pressure sensor has good performance. Compared with traditional pressure sensors, these sensors based on SIP have small volume, low cost, and could compatible with the strict standard of vehicle.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010

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