Cart (Loading....) | Create Account
Close category search window
 

The study of flip-chip Cu stud bump's reliability based on PCA-BP neural networks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Zhang Shan-shan ; Sch. of Machinetronic Eng., Anyang Inst. of Technol., Anyang, China ; Zhang Chang-ying ; Zhang Jing ; Mu Wei

In this paper, the model of Cu stud bump is established by ANSYS/LS-DYNA, and under different parameters such as: the chopper, copper wire diameter and pad size and so on, simulate the process of forming dynamically. Collect the relevant data as the BP neural network training and test samples. In accordance with the problems that BP neural network which has overabundance input factors exists the slow convergence and the low forecasting precision, the method of PCA is established to decompose the input factors, reduce the input factor dimension and eliminate the input factor linear correlation, and then based on the implementation of the improved BP algorithm by adding the item of the momentum, the model is established. The simulation result shows that: this model has a faster training speed and higher rate of accuracy and can better predict the post-welding Cu stud bump's quality, so as to optimize the process parameters and provide an effective way to improve the Cu stud bump's reliability.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.