By Topic

Development of flip-chip interconnections of photodetector readout circuit (ROIC)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Gaowei Xu ; Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, China ; Qiuping Huang ; Yuan Yuan ; Xiao Chen
more authors

In this paper, the interconnection between 16×16 photodetector ROIC and substrate for the ROIC test was developed. Three kinds of substrate methods, i.e. high-density organic substrate, silicon interposer substrate and through-silicon-via (TSV) technology, were adopted. Three corresponding technical process flows were designed, and corresponding experiments were conducted. Finally, the interconnection between photodetector ROIC and substrates as well as the test of ROIC performance were realized. Above three solutions were compared and evaluated in process realizability, interconnection performance and cost etc. It turns out that TSV method is considered as the advanced and ideal interconnection solution for the test of 16×16, 32×32 and 64×64 photodetector ROIC.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010