By Topic

Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Sung-Mao Wu ; Department of Electrical Engineering, University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, 81148, Taiwan, China ; Sheng-Wei Guan ; Chun-Ting Kuo ; Bo-Huei Yu
more authors

In this study, a novel impedance match-able structure of QFP (Quad Flat Package) socket contactor is presented. Application property and design formulas of impedance matching varying contactor section length are focus in this paper. Besides, through the use of a transmission line with single-stub tuning theorem and modulating the length of transmission line, novel QFP (Quad Flat Package) socket contactor could achieve impedance matching between DUT and test board. To verify used-method is feasible, RF characterizations are simulated and compared by 3D-EM Solver, Ansoft HFSS, and circuit simulation software, Agilent ADS. According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20 GHz bandwidth because the return loss is very smaller than -20 dB and insertion loss approximate 0 dB. Another, according to the design formulas derivate in this paper, designer can estimate the effect of contacts which may influence the design before earlier design stage.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010