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Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation

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6 Author(s)
Sung-Mao Wu ; Dept. of Electr. Eng., Univ. of Kaohsiung, Kaohsiung, Taiwan ; Sheng-Wei Guan ; Chun-Ting Kuo ; Bo-Huei Yu
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In this study, a novel impedance match-able structure of QFP (Quad Flat Package) socket contactor is presented. Application property and design formulas of impedance matching varying contactor section length are focus in this paper. Besides, through the use of a transmission line with single-stub tuning theorem and modulating the length of transmission line, novel QFP (Quad Flat Package) socket contactor could achieve impedance matching between DUT and test board. To verify used-method is feasible, RF characterizations are simulated and compared by 3D-EM Solver, Ansoft HFSS, and circuit simulation software, Agilent ADS. According simulation results, each ports of this novel QFN socket contactor are impedance matching up to 20 GHz bandwidth because the return loss is very smaller than -20 dB and insertion loss approximate 0 dB. Another, according to the design formulas derivate in this paper, designer can estimate the effect of contacts which may influence the design before earlier design stage.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010