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A compact system-level simulation method for modern microelectronic packaging

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3 Author(s)
Shihu Sun ; Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China ; Jing Song ; Qing-An Huang

For wafer-level packages with numerous solder balls and other repetitive structures, it's not practical to analyze the wafer-level behavior of the whole structure with the conventional finite-element method (FEM). A package-level nodal analysis method (PLNAM) is developed based on the partitioning concept. Using the functional elements, rather than the finite element in FEM, a large or complex package system can be interpreted using a simpler model with the elements interconnected through nodes. Result shows that the error of the nodal displacement can be kept within 5% with proper consideration of the surface compliance effect and the simulation process is much faster than FEM.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010