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Advanced yield enhancement: computer-based spatial pattern analysis. Part 1

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3 Author(s)
Lee, F. ; Motorola Inc., Chandler, AZ, USA ; Chatterjee, A. ; Croley, D.

Wafer-level defect distributions and yield patterns are a significant source of information about the performance of a manufacturing line. Computer-based techniques are ideal for pattern analysis because they provide the ability to quickly perform systematic, repetitive analyses on large data sets. The development of algorithms for computer-based spatial pattern analysis are described and initial test results are presented. Integration of automated spatial pattern analysis into the manufacturing process is discussed

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996

Date of Conference:

12-14 Nov 1996

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