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Defect reduction through statistical process control and prior-level subtraction analysis

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1 Author(s)
Shanks, D. ; Microelectron. Div., IBM Corp., Essex Junction, VT, USA

This paper discusses the reduction of defects in a nitride etching process using statistical process control (SPC). How defects are reduced in a contact process is also described

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996

Date of Conference:

12-14 Nov 1996