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Hybrid-mode computation of propagation and attenuation characteristics of parallel coupled microstrips with finite metallization thickness

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2 Author(s)
Jen-Tsai Kuo ; Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Itoh, T.

The hybrid-mode mixed spectral domain approach (MSDA) is formulated to investigate the dispersion nature of multiple coupled microstrip lines with arbitrary metallization thickness. Incorporated into the solution procedure, a new set of basis functions with δ -1/3 field singularity near conductor edges is found to be effective in calculating both the phase and attenuation constants. The computation of conductor loss is based on the perturbation procedure. Over a broad band of frequency spectrum, excellent agreement is obtained between the calculated results and existing experiment data for the metallic losses of a single microstrip and effective dielectric constants of coupled lines. The influence of finite metallization thickness on the frequency dependent modal propagation and attenuation characteristics is presented for both a three-line and four-line structure

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 2 )

Date of Publication:

Feb 1997

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