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A Novel Technique and Soldering Method to Improve Performance of Transparent Polymer Antennas

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4 Author(s)
T. Peter ; Wireless Networks and Communications Centre (WNCC), School of Engineering and Design, Brunel University, West London, UK ; R. Nilavalan ; Hattan F. AbuTarboush ; S. W. Cheung

A novel technique and a nonthermal soldering method to improve the performance of AgHT-8 transparent polymer antennas are proposed in this letter. The proposed technique involves the removal of the coating layer at areas on the coplanar waveguide (CPW) ground and feed line where the connectors of the coaxial feed or legs of the SMA connectors will be attached and applying a coat of silver paint on the exposed areas before cold-soldering the coaxial connections or SMA connector legs. The nonthermal or cold soldering using electrically conductive paste enables direct soldering of the coaxial feed points or connector legs, which cannot otherwise be done with hot or thermal soldering. This type of connection greatly enhances the performance of the AgHT-8 polymer antennas compared to coaxial feed point connections through hot-soldered copper pads glued to the surface of the polymer coating. The proposed technique also gives a stronger connection bond than directly cold-soldering the feed points or connectors to the smooth surface of the AgHT-8 material. Furthermore, the copper pad connection technique also introduces additional losses contributed by the adhesive properties of the glue used. This proposed novel technique and soldering method may be extended to enhance antenna performance made from other similar transparent conductive polymers like ITO.

Published in:

IEEE Antennas and Wireless Propagation Letters  (Volume:9 )