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3D IC design improves performance and decreases power consumption by replacing long horizontal interconnects with short vertical ones. Achieving higher performance along with reducing the network latency can be obtained by utilizing an efficient communication protocol in 3D Networks-on-Chip (NoCs). In this work, several unicast/multicast partitioning methods are explained in order to find an advantageous method with low communication latency. Moreover, two factors of efficiency, unicast latency and multicast latency, are analyzed by analytical models. We also perform simulation to compare the efficiency of proposed methods. The results show that Mixed Partitioning method outperforms other methods in term of latency.