Cart (Loading....) | Create Account
Close category search window
 

Multiple Error Detection in DNA Self-Assembly Using Coded Tiles

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hashempour, M. ; Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA ; Arani, Z.M. ; Lombardi, F.

This brief deals with error detection in deoxyribonucleic acid self-assembly; coding and mapping functions are utilized to assess a correct (error-free) attachment of a tile to a site in the growth process. The proposed approach utilizes the coding/mapping features of the bonds in the tile set by utilizing single and multiple (combined) properties. Properties are combined through an iterative process that considers the aggregate of the intended pattern through coding of the bonds. As a widely used pattern and instantiation of this process, the Sierpinski Triangle self-assembly is analyzed in detail. The properties proposed for the Sierpinski Triangle allow extending single-error detection to the scenario of multiple clustered errors.

Published in:

Circuits and Systems II: Express Briefs, IEEE Transactions on  (Volume:57 ,  Issue: 9 )

Date of Publication:

Sept. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.