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Low-Temperature Wiring with Ag Nanoinks [Nanopackaging]

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4 Author(s)
Suganuma, K. ; Tohoku Univ., Sendai, Japan ; Wakuda, D. ; Hatamura, M. ; Nogi, M.

In this article, the mechanisms of these low-temperature curable inks are briefly reviewed. The dispersant removal by washing in alcohols for the nanoparticle ink and the decomposition behavior of the β-ketocarboxylate ink were clarified by thermal and microstructural analyses. The sintering and growth behaviors were also examined.

Published in:

Nanotechnology Magazine, IEEE  (Volume:4 ,  Issue: 3 )